MIL-HDBK-419A Grounding, Bonding, and Shielding for Electronic Equipments and Facilities Volume 2 of 2  


This document provides basic and application information on grounding, bonding, and shielding practices recommended for electronic equipment. It will provide valuable information and guidance to personnel concerned with the preparation of specifications and the procurement of electrical and electronic equipment for the Defense Communications System. The handbook is not intended to be referenced in purchase specifications except for informational purposes, nor shall it supersede any specification requirements.

Federal Facility Criteria: